European space missions are on the path towards greater processing power with the development of advanced integrated circuits through ESA’s Ultra Deep Submicron Initiative. The initiative aims to create microprocessors with finer detail, pushing for circuit features to be reduced dramatically. This is crucial for enhancing the performance and capability of future space missions.
The harsh radiation environment in space poses a challenge for electronics, which are exposed to high-energy particles and cosmic rays that can disrupt memory or cause permanent damage. Engineers are working on protective circuit designs, redundant memory systems, and error detection mechanisms to combat these risks.
Sweden-based company Frontgrade Gaisler is leading the initiative by establishing radiation-hardened libraries and intellectual property cores for highly reliable and efficient integrated circuits. The consortium is collaborating with a non-European foundry for the advanced 7 nm process with plans to shift production to Europe as capabilities grow.
The initiative is part of ESA’s ‘EEE Space Components Sovereignty for Europe’ programme under the EU’s European Chips Act, aiming to strengthen Europe’s space electronics supply chain from design to production and testing. This investment in cutting-edge technology will ensure that Europe remains at the forefront of innovation and autonomy in space exploration, including advanced AI and Edge computing for next-generation space missions and satellite constellations.
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